Up to 6800MT/s DDR5 memory provides superb speed, capacity and reliability for next-generation gaming platforms. Level up your machine's performance with enhanced features like on-die ECC for improved stability and dual 32-bit subchannels to boost efficiency. DDR5 memory offers overclock specs for Intel XMP 3.0 and AMD EXPO with customisable profiles for speeds and timings to help you maximise your gaming experience, livestream at 4K or push animation and 3D rendering projects. With on-die ECC for improved stability at extreme speeds, dual 32-bit subchannels for increased efficiency and an on-module power management integrated circuit to provide power where needed most. Superior speed advancements with double the banks from 16 to 32 and double the burst length from 8 to 16 take DDR5 memory and your overall system applications to the next level of performance. Whether pushing the limits in gaming with extreme settings, live streaming at 4K or handling large animation and 3D rendering, this DDR5 memory is the level-up needed. Advanced pre-optimised timings, speed and voltage for overclocking performance with user-customisable profiles. Tested and approved so you can build and upgrade with confidence on your preferred motherboard. Low-profile heat spreader newly designed for bold styling and outstanding cooling functionality.

On-Die ECC: Yes; CAS latency: 36; Internal memory: 32 GB; Memory layout (modules x size): 1 x 32 GB; Internal memory type: DDR5; Memory data transfer rate: 5600 MT/s; Component for: PC; Memory form factor: 288-pin DIMM; ECC: No; Buffered memory type: Unregistered (unbuffered); Memory ranking: 2; Memory voltage: 1.25 V; Module configuration: 4096M x 64; Row cycle time: 48 ns; Refresh row cycle time: 295 ns; Row active time: 32 ns; AMD Extended Profiles for Overclocking (EXPO): Yes; AMD Extended Profiles for Overclocking (EXPO) version: 1.0; SPD profile: Yes; Programming power voltage (VPP): 1.8 V; Cooling type: Heatsink; Lead plating: Gold; Backlight: No; JEDEC standard: Yes; Operating temperature (T-T): 0 - 85 °C; Storage temperature (T-T): -55 - 100 °C; Width: 6.62 mm; Depth: 133.3 mm; Height: 34.9 mm; Weight: 34.59 g; Package width: 57.1 mm; Package depth: 14 mm; Package height: 171.4 mm; Package weight: 54.1 g; Products per master (outer) case: 25 pc(s); Master (outer) case width: 196.8 mm; Master (outer) case length: 311.1 mm; Master (outer) case height: 61 mm; Master (outer) case gross weight: 1.5 kg; Country of origin: China, Taiwan

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