FURY Beast DDR5 memory provides superb speed, capacity and reliability for next-generation gaming platforms. Enhanced features include on-die ECC for better stability and dual 32-bit subchannels to boost efficiency. FURY Beast DDR5 offers overclock specs for Intel XMP 3.0 and AMD EXPO with customisable profiles for speeds and timings to maximise your gaming experience, livestream at 4K or push animation and 3D rendering projects. The memory brings cutting-edge technology including on-die ECC for improved stability at extreme speeds, dual 32-bit subchannels for increased efficiency and an on-module power management integrated circuit. Superior speed advancements with double the banks and double the burst length take DDR5 memory and your system applications to the next level of performance. Whether pushing the limits in gaming with extreme settings, live streaming at 4K or handling large animation and 3D rendering, FURY Beast DDR5 memory is the upgrade needed while combining style and performance. With Intel XMP 3.0 or AMD EXPO options, FURY Beast DDR5 has compatible overclock solutions covered. On-die ECC helps maintain data integrity to sustain ultimate performance while overclocking. DDR5 excels with the latest games, programmes and demanding applications. Modules are tested and approved by the world's leading motherboard manufacturers so you can build and upgrade with confidence. The low-profile heat spreader combines bold styling with outstanding cooling functionality.

On-Die ECC: Yes; CAS latency: 36; Internal memory: 16 GB; Memory layout (modules x size): 1 x 16 GB; Internal memory type: DDR5; Memory data transfer rate: 5600 MT/s; Component for: PC; Memory form factor: 288-pin DIMM; ECC: No; Buffered memory type: Unregistered (unbuffered); Memory ranking: 1; Memory voltage: 1.25 V; Module configuration: 2048M x 64; Row cycle time: 48 ns; Refresh row cycle time: 295 ns; Row active time: 32 ns; AMD Extended Profiles for Overclocking (EXPO): Yes; AMD Extended Profiles for Overclocking (EXPO) version: 1.0; SPD profile: Yes; Programming power voltage (VPP): 1.8 V; Cooling type: Heatsink; Lead plating: Gold; Backlight: No; JEDEC standard: Yes; Operating temperature (T-T): 0 - 85 °C; Storage temperature (T-T): -55 - 100 °C; Width: 6.62 mm; Depth: 133.3 mm; Height: 34.9 mm; Weight: 33.74 g; Package width: 57.1 mm; Package depth: 14 mm; Package height: 171.4 mm; Package weight: 54.1 g; Products per master (outer) case: 25 pc(s); Master (outer) case width: 196.8 mm; Master (outer) case length: 311.1 mm; Master (outer) case height: 61 mm; Master (outer) case gross weight: 1.5 kg; Country of origin: China, Taiwan

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